Power Driver Modules - EPC Space, LLC - Electronic Components Distributor

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

Featured Products

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
FBS-GAM02-P-C50	EPC Space, LLC	50V 10A HALF BRIDGE	3072	RFQ	Bulk	Active	Detail
FBS-GAM02P-R-PSE	EPC Space, LLC	GAN DUAL HI/LO SIDE DRIVER 18SMT	3187	RFQ	Bulk	Active	Detail
FBS-GAM02P-C-PSE	EPC Space, LLC	DUAL HIGH & LOW SIDE DRIVER	4116	RFQ	Bulk	Active	Detail
FBS-GAM01P-C-PSE	EPC Space, LLC	SINGLE LOW SIDE DRIVER	5461	RFQ	Bulk	Active	Detail
FBS-GAM01-P-C50	EPC Space, LLC	50V 10A SINGLE LOW SIDE DRIVER	8073	RFQ	Bulk	Active	Detail
FBS-GAM04-P-C50	EPC Space, LLC	50V 10A DUAL LOW SIDE DRIVER	3001	RFQ	Bulk	Active	Detail
FBS-GAM04-P-C100	EPC Space, LLC	100V 5A DUAL LOW SIDE DRIVER	2601	RFQ	Bulk	Active	Detail
FBS-GAM01-P-C100	EPC Space, LLC	100V 5A SINGLE LOW SIDE DRIVER	4524	RFQ	Bulk	Active	Detail
FBS-GAM01-P-R50	EPC Space, LLC	GAN 50V 10A LOW SIDE DRVR 9SMT	4434	RFQ	Bulk	Active	Detail
FBS-GAM02-P-R50	EPC Space, LLC	GAN 50V 10A HALF BRIDGE 18SMT	7836	RFQ	Bulk	Active	Detail

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Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.