Power Driver Modules - XP Power - Electronic Components Distributor

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

Featured Products

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
QHL75300S05	XP Power	DC-DC 75W BASEPLATE COOLED	2998	RFQ	Box	Active	Detail
QHL75300S48	XP Power	DC-DC 75W BASEPLATE COOLED	3762	RFQ	Box	Active	Detail
QHL75300S24	XP Power	DC-DC 75W BASEPLATE COOLED	9105	RFQ	Box	Active	Detail
LDU0716S500	XP Power	LED SUPPLY CC BUCK 2-14V 500MA	8918	RFQ	Tube	Obsolete	Detail
LDU0830S300	XP Power	LED SUPPLY CC BUCK 2-28V 300MA	6152	RFQ	Tube	Obsolete	Detail
LDU1416S600	XP Power	LED SUPPLY CC BUCK 2-14V 600MA	2120	RFQ	Tube	Obsolete	Detail
LDU2030S600	XP Power	LED SUPPLY CC BUCK 2-28V 600MA	2962	RFQ	Tube	Obsolete	Detail
LDU2430S600	XP Power	LED SUPPLY CC BUCK 2-28V 600MA	7158	RFQ	Tube	Obsolete	Detail
LDU4860S250	XP Power	LED SUPPLY CC BUCK 2-57V 250MA	7063	RFQ	Tube	Obsolete	Detail
LDU4860S300	XP Power	LED SUPPLY CC BUCK 2-57V 300MA	9468	RFQ	Tube	Obsolete	Detail
LDU4860S600	XP Power	LED SUPPLY CC BUCK 2-57V 600MA	6763	RFQ	Tube	Obsolete	Detail
LDU0516S300	XP Power	LED SUPPLY CC BUCK 2-14V 300MA	7042	RFQ	Tube	Obsolete	Detail

1 / 3 page，total 25 results

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.