Power Driver Modules - Tamura - Electronic Components Distributor

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

Featured Products

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
2DUC51008CXE1	Tamura	GATE DRIVER UNIT (WITHOUT GATE R	9727	RFQ	Tray	Active	Detail
2DM150806CM	Tamura	IC GATE DRVR HALF-BRIDGE 0502	5637	RFQ	Tray	Active	Detail
2DM180206CM	Tamura	IC GATE DRVR HALF-BRIDGE 0502	7181	RFQ	Tray	Active	Detail
2DM180506CM	Tamura	IC GATE DRVR HALF-BRIDGE 0502	5238	RFQ	Tray	Active	Detail
4DUC51016CFA2	Tamura	GATE DRIVER UNIT FOR FUJI ELECTR	7449	RFQ	Tray	Active	Detail
4DUC51016CFA1	Tamura	GATE DRIVER UNIT FOR FUJI ELECTR	2555	RFQ	Tray	Active	Detail
4DUD51016CFN1	Tamura	GATE DRIVER UNIT FOR FUJI ELECTR	7532	RFQ	Tray	Active	Detail
2CG010BBC11N	Tamura	GATE DRIVER (CORE, +15V,-10V)	6120	RFQ	Tray	Active	Detail
2CG010BBC12N	Tamura	GATE DRIVER (CORE, +15/,-15V)	7310	RFQ	Tray	Active	Detail
2QG010DDC11N	Tamura	GATE DRIVER FOR2MBI1800XXG170-50	4119	RFQ	Tray	Active	Detail
2DUC51008DXE1	Tamura	GATE DRIVER UNIT (WITHOUT GATE R	6947	RFQ	Tray	Active	Detail
2DU180506MR01	Tamura	(ROHM: BSM120D12P2C005)	2313	RFQ	Bulk	Active	Detail

1 / 3 page，total 33 results

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.