Power Driver Modules - Powerex Inc. - Electronic Components Distributor

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

Featured Products

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
VLA542-11R	Powerex Inc.	IC GATE DRVR PWR MGMT MOSFET	7372	RFQ	Bulk	Active	Detail
M57962L-71R-02	Powerex Inc.	IC GATE DRVR PWR MGMT MOSFET	14862	RFQ	Bulk	Active	Detail
VLA500-01	Powerex Inc.	IC GATE DRVR LOW-SIDE MODULE	1668	RFQ	Bulk	Active	Detail
VLA502-01	Powerex Inc.	IC GATE DRVR LOW-SIDE MODULE	2054	RFQ	Bulk	Active	Detail
VLA567-11R	Powerex Inc.	PWR MGMT MOSFET/PWR DRIVER	7698	RFQ	Bulk	Active	Detail
VLA536-01R	Powerex Inc.	BOARD INTERFACE NX-SERIES	9227	RFQ	Box	Active	Detail
PSM03S93E5-A	Powerex Inc.	MOD IPM 6-PAC 3A 500V DIP	9128	RFQ	Tray	Active	Detail
PSM05S93E5-A	Powerex Inc.	MOD IPM 6-PAC 5A 500V DIP	1986	RFQ	Tray	Active	Detail
PM50RL1A060	Powerex Inc.	MOD IPM 7-PAC L1 50A 600V	6043	RFQ	Bulk	Active	Detail
VLA541-01R	Powerex Inc.	IC GATE DRVR LOW-SIDE MODULE	8733	RFQ	Bulk	Obsolete	Detail
PS22A72	Powerex Inc.	MOD IPM 1200V 5A LARGE DIP	4473	RFQ	Bulk	Active	Detail
PS22A76	Powerex Inc.	MOD IPM 1200V 25A LARGE DIP	4321	RFQ	Bulk	Active	Detail

1 / 28 page，total 330 results

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.