Power Driver Modules - onsemi - Electronic Components Distributor

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

Featured Products

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
FSB50550AS	onsemi	MODULE SPM 500V 2A SPM5Q	4076	RFQ	Tape & Reel (TR)	Active	Detail
NFAQ1560R43TL	onsemi	INTELLIGENT POWER MODULE (IPM),	6921	RFQ	Tube	Active	Detail
FNB40560	onsemi	MODULE SPM 600V 5A 26PWRDIP	8487	RFQ	Tube	Not For New Designs	Detail
FSB50250AS	onsemi	MODULE SPM 500V 1.2A 23PWRSMD	8957	RFQ	Tape & Reel (TR)	Active	Detail
NFAQ1560R43T	onsemi	MODULE IPM 600V 15A DIPS6	4999	RFQ	Tube	Active	Detail
FDMF5175	onsemi	VR14 30A PQFN45 POWER STA	3000	RFQ	Tape & Reel (TR)	Active	Detail
FDMF5076	onsemi	IC SPS MOD PWR STAGE 35A PQFN24	3000	RFQ	Tape & Reel (TR)	Active	Detail
FSB50450US	onsemi	MODULE SPM 500V 1.0A SPM23-BD	7776	RFQ	Tape & Reel (TR)	Not For New Designs	Detail
FSB50550ASE	onsemi	MODULE SPM 500V 2A SPM5Q	4375	RFQ	Tape & Reel (TR)	Not For New Designs	Detail
FSB50550US	onsemi	MODULE SPM 500V 1.2A SPM23	4934	RFQ	Tape & Reel (TR)	Not For New Designs	Detail
FSB70550	onsemi	MODULE SPM 500V 5.3A 27PWRLQFN	1000	RFQ	Tape & Reel (TR)	Active	Detail
FSB50250AT	onsemi	MODULE SPM 500V 1.2A 23PWRDIP	4060	RFQ	Tube	Active	Detail

1 / 23 page，total 274 results

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.