Power Driver Modules - Schneider Electric - Electronic Components Distributor

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

Featured Products

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
VX5G48D17Y	Schneider Electric	POWER BOARD, ATS48D17Y	7901	RFQ	Box	Active	Detail
VX5G48D32Y	Schneider Electric	POWER BOARD, ATS48D32Y	6588	RFQ	Box	Active	Detail
VX5G48D38Y	Schneider Electric	S	8790	RFQ	Box	Active	Detail
VX5G48D47Y	Schneider Electric	POWER BOARD, ATS48D47Y	5890	RFQ	Box	Active	Detail
VX5G48D62Y	Schneider Electric	POWER BOARD, ATS48D62Y	8451	RFQ	Box	Active	Detail
VX5G48D75Y	Schneider Electric	POWER BOARD, ATS48D75Y	9377	RFQ	Box	Active	Detail
VX5G48D88Y	Schneider Electric	POWER BOARD, ATS48D88Y	7752	RFQ	Box	Active	Detail
VX5G48C11Y	Schneider Electric	POWER BOARD, ATS48C11Y	4697	RFQ	Box	Active	Detail
VX5G48C14Y	Schneider Electric	POWER BOARD, ATS48C14Y	2800	RFQ	Box	Active	Detail
VX5G48C17Y	Schneider Electric	POWER BOARD, ATS48C17Y	3067	RFQ	Box	Active	Detail
VX5G48C21Y	Schneider Electric	POWER BOARD, ATS48C21Y	5171	RFQ	Box	Active	Detail
VX5G48C25Y	Schneider Electric	POWER BOARD, ATS48C25Y	2174	RFQ	Box	Active	Detail

1 / 2 page，total 21 results

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.