【Lansheng Technology News】On October 30, 2023, STMicroelectronics released the ACEPACK[1] DMT-32 series of automotive-grade silicon carbide (SiC) power modules. The new series of products adopts a convenient 32-pin dual in-line pass-through Hole plastic package, the target application is on-board chargers (OBC), DC/DC DC transformers, oil pumps, air conditioners and other automotive systems. The product advantages include high power density, highly compact design and easy assembly. It provides four-tube full-bridge, Three-phase six-tube full-bridge and totem pole package configurations enhance system design flexibility.
The new module has a built-in 1200V SiC power switch. STMicroelectronics’ second- and third-generation SiC MOSFET advanced technologies ensure that the silicon carbide switch has a very low on-resistance RDS(on). The module has efficient switching performance, minimizing temperature effects and ensuring high energy efficiency and reliability of the power conversion system.
Using ST's proven and robust ACEPACK packaging technology, these modules reduce overall system and design development costs while ensuring excellent reliability. This packaging technology uses a high-performance aluminum nitride (AlN) insulating substrate with excellent thermal performance. There is also an NTC temperature sensor inside the package to provide temperature monitoring information for the thermal protection mechanism.
The M1F45M12W2-1LA launched this time is the first product of the ACEPACK DMT-32 series, and mass production will begin in the fourth quarter of 2023. Samples of M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, and M1P30M12W3-1LA are now available, with mass production starting in the first quarter of 2024. Selling price depends on product configuration.
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