Nexperia Shanghai Lingang Wafer Fab Phase I has completed trial production

【Lansheng Technology News】Wingtech Technology recently stated in a survey that Nexperia's wafer fabs in Hamburg, Germany and Manchester, UK are continuing to undergo technological transformation and upgrading. The first phase of the Shanghai Lingang wafer fab invested and constructed by the company's controlling shareholder has completed trial production, with a throughput rate of more than 95%. It has now obtained ISO certification and automotive grade IATF16949 compliance certification, and is expected to reach production in 2024.

On November 9, Nexperia sold the previously acquired British Newport Wafer Fab (NWF) wafer manufacturing plant to US semiconductor manufacturer Vishay Intertechnology for US$177 million.

This transaction was mainly affected by geopolitics and was not caused by the company's operating problems. Everyone thought that Nexperia would go silent because of this, but unexpectedly, only two days later, news of the cooperation between Mitsubishi Electric and Nexperia came out.

Mitsubishi Electric announced on November 13 that it will establish a strategic partnership with Nexperia to jointly develop silicon carbide (SiC) power semiconductors for the power electronics market. Mitsubishi Electric will use its wide-bandgap semiconductor technology to develop and supply SiC MOSFET chips, which will be used by Nexperia to develop SiC discrete devices.

According to the 2023 third quarter financial report released by Wingtech Technology, in the third quarter, Wingtech Technology achieved operating income of 15.206 billion yuan, a year-on-year increase of 11.90%; net profit attributable to shareholders of listed companies was 848 million yuan, a year-on-year increase of 11.42%. Among them, the semiconductor business achieved revenue of 3.999 billion yuan, a gross profit margin of 37.70%, and a net profit of 683 million yuan. Business revenue comes from the automotive field, accounting for more than 60%.

According to the analysis of TrendForce's "2023 Global SiC Power Semiconductor Market Analysis Report", the overall SiC power component market size will reach US$2.28 billion in 2023, with an annual growth of 41.4%.

Benefiting from the strong demand in the downstream application market, TrendForce predicts that the SiC power component market size is expected to reach US$5.33 billion by 2026, and its mainstream applications still rely heavily on electric vehicles and renewable energy.

In the future, with the completion of the transformation of Nexperia's overseas wafer fabs and the formal commissioning of the first phase of the Shanghai Lingang wafer fab, its SiC power device production capacity will also be increased to better meet market demand and consolidate its position in the world. SiC power market leadership.