Nexperia leads the MOSFET technology revolution and welcomes the era of automotive electrification

【Lansheng Technology Information】In the past decade, with the rapid development of mobile devices and Internet of Things technology, the demand for small and high-performance MOSFET packaging has been growing, and small packaging technologies such as QFN and DFN have emerged. In applications that require high current, good heat dissipation, and high reliability, the LFPAK package may be a better choice. However, in low-power applications, such as small-signal products, since the power change is not that large and the thermal stress is relatively small, the small-package DFN can fully demonstrate its size advantage.

Nexperia's DFN0606 MOSFET package provides the smallest DFN solution available in the commonly used 0.35mm pitch size. This ultra-small package is ideal for applications that require as little space as possible, saving space and requiring almost no additional assembly work. This MOSFET package is ideal for applications in small mobile products such as wearable devices.

In the past, a standard power switch with a given figure of merit could be used in basically any application. But with the advancement of technology and the diversification of applications, the demand for MOSFETs is more complex and diverse than ever before. There are more than 100 parameters on a regular MOSFET data sheet, such as Rds(on), Vth, Ciss, Qg, etc. But usually only a few parameters are critical in every project. And as the application changes, key parameters will also change.

Therefore, it is difficult for a single MOSFET parameter to meet the needs of all applications. Nexperia understands this very well and “Application Specific” is another major innovation in the field of MOSFETs, a product range based on years of understanding specific applications and working hand in hand with customers. By focusing on optimizing the parameters that are most critical to a certain application scenario, even if other less relevant parameters may be sacrificed, we ensure that our MOSFET products can perfectly match the needs of specific fields and achieve optimal performance and benefits.

Nexperia has created a richer range of application-specific MOSFETs. As shown in Figure 3 below, it can be roughly divided into two categories: automotive-grade MOS ASFETs and non-automotive-grade ASFETs. Their focuses are different. Among them, the hot-swappable ASFET LFPAK88 is currently mainly used in industrial and consumer electronic power supplies, and the automotive-grade MOS ASFET is mainly used in half-bridge, repetitive avalanche and airbag drives.

Nexperia's LFPAK56D half-bridge product is a major representative of application-specific MOSFETs. Due to the removal of PCB traces, it occupies 30% less PCB area than dual LFPAK56D. And because the MOSFETs are connected internally with copper clips, their parasitic inductance is reduced by 60%. The LFPAK56D half-bridge is AEC-Q101 automotive qualified, providing the automotive industry with a range of plug-and-play solutions with superior current handling capabilities. It can be widely used in three-phase automotive powertrain applications (fuel pumps, oil pumps and water pumps), motor control, DC/DC and other automotive applications.

The BUK7V4R2-40H product uses the LFPAK56D half-bridge package, which not only reduces PCB layout complexity, but also shrinks the PCB by reducing the component size of the three-phase motor driver. The optimized package design improves system-level R th(j-amb), supports higher efficiency with lower parasitic inductance, and is compatible with LFPAK56D dual packaging. By using advanced AEC-Q101 grade Trench 9 silicon technology, low power loss and high power density are achieved with excellent avalanche performance. Additionally, its unique gull-wing leads enable high manufacturability and automated optical inspection (AOI).

Driven by the dual drive of intelligence and electrification, MOSFET still has great potential. In this wave, Nexperia is actively driving the innovation and upgrading of MOSFET products. On the one hand, through the continuously optimized LFPAK packaging technology, MOSFET performance has been significantly improved and the size has been significantly reduced; on the other hand, for different application fields, Nexperia has launched a series of field-specific MOSFET products to meet diversified market needs. . This "two-wheel drive" strategy not only promotes the rapid evolution of Nexperia's MOSFET products towards smaller sizes, higher performance, and better heat dissipation, but will also greatly promote the rapid development of the automotive electrification process.