【Lansheng Technology News】On October 31, 2023,Micron Technology, Inc. announced that its low-power LPDDR5X DRAM and universal flash UFS 3.1 embedded solutions are now available through Qualcomm’s latest Extended Reality (XR) platform-Second Generation Snapdragon™ XR2 verification.
Micron's LPDDR5X and UFS 3.1 are compact in size, provide higher speeds, better performance and lower power consumption, and can flexibly support mixed reality (MR) and virtual reality (VR) devices. LPDDR5X is currently Micron's most advanced low-power memory, achieving lower power consumption through innovative 1α process node technology and JEDEC energy efficiency optimization.
The global augmented reality (AR) and virtual reality (VR) market size will grow at a compound annual growth rate of 24% from 2021, and is expected to reach US$200 billion by 2030. Micron's embedded products provide powerful, ready-to-use solutions for extended reality applications, accelerating consumer adoption and expanding market potential.
Micron'sLPDDR5X and UFS 3.1 enable parallel processing across multiple applications and sensors, creating a truly immersive experience for VR users by seamlessly integrating the changing shapes, locations and perceptions of the metaverse. Micron LPDDR5X can achieve peak rates of up to 8.533Gbps and is backward compatible with 6.4Gbps LPDDR5, providing equipment manufacturers with platform integration flexibility while reducing power consumption.
The second-generation Snapdragon XR2 processor, newly released on September 27 this year, was developed in close cooperation with Meta and has been put into commercial use for the first time on Meta’s latest headset, Meta Quest 3. The second-generation Snapdragon XR2 platform provides a single-chip architecture that enables new immersive MR and VR experiences in a headset that is thinner, more comfortable and does not require an external battery pack.
Meta Quest 3 spatial computing platform can provide a lag-free experience, bring stunning visual effects and immersive sound effects, allowing users to feel the integration of virtual content and the real world, and realize the integration between MR and VR experiences. Seamless conversion.
Compared with the previous generation product, LPDDR5X reduces power consumption by 24%, achieving a better user experience by extending battery life, and is ideal for MR and VR head-mounted devices. Micron LPDDR5X can achieve a peak data transfer rate of 8.533Gbps, improving data access speeds by 33% for Metaverse applications, resulting in faster response times. Micron's LPDDR5X memory based on the 1α process node can provide better capacity density, performance and energy efficiency for extended reality devices.
Micron UFS 3.1 client storage is the world's first UFS using Micron's 176-layer NAND technology. It has a compact form factor and high storage density, providing greater design flexibility for small devices such as MR and VR headsets.
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